Thermal Paste (grease)
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TSK5303-1KG packaging tin

Details
TSK5303 silicon-thermal conductivity is specifically designed as a compound for heat radiation or heat conduction with the medium. The product provides excellent electrical properties, thermal conductivity, and ease of application. TSK5303 can be effectively used because of its excellent thermal durability at temperatures up to 300 ℃.
main feature
♦ high temperature
♦ excellent thermal conductivity
♦ excellent electrical properties
♦ Easy to use
♦ low volatility
application
A semiconductor element, such as rectifiers, thyristors and integrated circuits ♦ heat transfer medium
♦ thermally connected thermistors, thermocouples wife and other media and temperature measuring point
♦ heat and thermally conductive medium between the radiator heating appliances
♦ medium heat and heat transfer between the heat exchanger