Potting
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TIA207GN
Details
TIA207G is a two-component, thermally conductive potting material and fill in the blanks.
TIA207G mobility allows it to be potted and comply with complex 3D shapes
And fill the gap, thereby creating a thermal path to remove heat. TIA207G
Rapid heating and exposure therapy to soft rubber to help ease the pressure of important electronic
Components.
main feature
• Good thermal conductivity
• curing speed, exposure to heat
• After holding cured softness, contribute to the thermal cycling process to relieve stress
• Easy to use 1: 1 ratio
• the equivalent of V-0
application
LED light bulbs and other power-driven heat potting.
TIA207G mobility allows it to be potted and comply with complex 3D shapes
And fill the gap, thereby creating a thermal path to remove heat. TIA207G
Rapid heating and exposure therapy to soft rubber to help ease the pressure of important electronic
Components.
main feature
• Good thermal conductivity
• curing speed, exposure to heat
• After holding cured softness, contribute to the thermal cycling process to relieve stress
• Easy to use 1: 1 ratio
• the equivalent of V-0
application
LED light bulbs and other power-driven heat potting.
