Industry News
Your current location:Home >> News >> Industry News
Thermal silica materials have specific thermal conductivity and thermal silicone potting
  Smear thermal silica should be noted that, due to the thermal silica when the first use will be melted CPU temperature, and then the adhesive evenly on the CPU and heat sink, when the temperature drops to cool, silica gel and put the CPU heatsink closely linked together Therefore, when the applicator should be careful not to smear too much, otherwise after melting temperature silicone will flow above the CPU socket, CPU will not only be firmly glued to the CPU socket, but also may make CPU pins insulated, lead CPU does not work!
  Removing the sticky heat conductive silicone CPU complex, usually only cut with a knife. Since the ceramic CPU is very strong, so if you can do completely bold and careful, which is now no reason for a person when then-purpose adhesive thermal silica (Tai Lao universal adhesive was almost impossible to separate from the CPU and heat sink) .