中文版
|
English
Home
About Us
Company Profile
General Manager Speech
Company Culture
Corporate Image
Certifications
Agent Product
Momentive Electronics Silicone
Momentive Silicone Mold
Momentive Environmental trademark silicone
Momentive Silicone Products FAQ
Pelnox Electronics Applications
Pelnox Hand Application
News
Company News
Industry News
Video
Careers
Order
Feedback
Contact Us
Categories
Momentive
Momentive Electronics Silicone
RTV Product description
RTV Applications
Adhesives and sealing
Cover-based paint
Encapsulation
Potting
Thermal management
Thermal plastic
Thermal paste (grease)
Actual Application
COG LCM Encapsulation
LED Encapsulation
LED Illumination
PTC Thermistor
POWER
Solar
Momentive Silicone mold
Palm with silicone mold
Jewelry, diamond silicone mold
Momentive Environmental trademark silicone
Momentive Silicone Products FAQ
Pelnox
Pelnox Electronics Applications
Pelnox Hand Application
PU resin vacuum injection
Polyurethane
Epoxy
Low-pressure perfusion (RIM)
Encapsulation
Your current location:
Home
>>
Agent Product
>>
Momentive Electronics Silicone
>>
RTV Applications
>>
Encapsulation
主要用于LED封装用,具有良好的折射率和透光性,可有效的传递LED所激发之光源,并提供优越的耐久性及可靠度,耐黄变,无微泡,不分层和低黏度,适用于不同型态的LED封装。
TSE3282-G
XE13-C2476
XE12-B2543
XE14-C0447
TSE3032
TSE3033
RTV615
Home
1
2
Last
Partner: